CO1:   Ability to define, calculate and solve problems on standard unit, force and motion, and their applications.

CO2:   Ability to define, calculate and solve problems on the concept of linear momentum and forces on material.

CO3:   Ability to define, calculate and solve and apply circular motion principles, oscillation & wave.

CO4:   Ability to define, calculate and solve problems on the basics of electrostatic and electromagnetism.

CO5:   Ability to define, calculate and solve problems on simple DC circuit.

Define and explain physical quantity and dimension; calculate and analyze dimensional analysis.

Define, remember, and explain scalars, vectors and their components, motion equations, and forces. Calculate and solve problems on forces and motions.

Define, calculate, and solve linear momentum, Impulse, Conservation of linear momentum, elastic and inelastic collisions

Define and solve problems on Strain, Stress, Fracture, Elasticity, Hooke’s Law, Poisson’s ratio

Define and explain frequency and period, calculate Angular Measure, Angular Speed and Velocity, Frequency and Period, Uniform Circular Motion and Centripetal acceleration.

Define and explain types of waves, wave motion and its parameter, generation of waves. Calculate and solve problems on wave motion and its parameter, frequency, wavelength.

Define, explain and illustrate Coulomb’s law, electric field, capacitance and resistance, and electric force line. Calculate capacitors in series and parallel and electric forces.

 Define and explain interaction between current and magnetic fields, ferromagnetic materials. Calculate and solve problems on magnetic field force in various applications, generators Induced EMF with two coils.

Define and explain Ohms Law and Kirchoffs Law, Resistivity, and concept of drift velocity and electric charges. Calculate resistance of various connections, electric power, andsolve problems on simple circuit problems.

1. Jerry Wilson, Anthony Buffa. “College Physics”, 7^th  ed., Pearson Education, 2009,USA

1. Giambattista,Richardson,Richardson, “College Physics”, McGraw Hill International Ed., 2007.

2. Stephen T.Thornton, Andrew Rex. “Modern Physics for Scientists & Engineers”, 2^nd ed, Brooks Cole, 1999.

3. W. Bolton. “Engineering Science”. Fourth Edition. Newnes. 2001

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CO1:    Ability to identify the basic circuit elements, calculate and solve a circuit using Ohms Law.

CO2:    Ability to identity, calculate and solve a circuit using method of circuit analysis and network theorem in DC electric circuit.

CO3:    Ability to identify, define calculate capacitance, inductance, initial and steady state condition in RL and RC circuit.

• Define and Explain the meaning of circuit analysis, Systems of units, voltage and currents.
• Define and Calculate power, energy, resistance and colour coding.
• Define elements on the circuit (passive and active) voltage and current source.
• Describe and Apply Ohm`s Law and power calculation with passive sign calculation.
• Define Nodes , Branches and Loops

• Define and Explain the meaning of series circuits, Kirchhoff`s voltage law and voltage divider rule.
• Describe and Apply  Kirchhoff`s voltage law and voltage divider rule in series circuits.
• Define and Explain the meaning of parallel circuits, Kirchoff`s current law and current divider rule.
• Describe and Apply  Kirchhoff`s current law and current divider rule in parallel circuits.
• Describe Delta to Wye Conversion ,Wye to Delta Conversion
• Identify and apply Delta to Wye Conversion, Wye to Delta Conversion in circuit analysis.
• Calculate Resistors

• Describe, Apply and Solve Method of Nodal analysis, Nodal analysis with dependence sources and Nodal analysis with voltage sources.
• Describe ,Apply and Solve Method of Mesh analysis, Mesh analysis with dependence sources, Mesh analysis with current sources.

• Describe, Apply and Solve using sources transformation
• Describe, Apply and Solve using Superposition theorem
• Describe, Apply and Solve using Thevenin`s theorem
• Describe, Apply and Solve using Norton theorem
• Evaluate and CalculateMaximum power transfer

• Describe passive linear circuit elements: capacitors
• Explain and calculate capacitors, relationships between voltage, current and energy for capacitor .
• Apply and Solve Series and parallel capacitance
• Describe passive linear circuit elements:  inductor
• Explain and calculate inductors, relationships between voltage, current and energy for capacitor .
• Apply and Solve Series and parallel inductance

• Identify, Calculate and Solve Natural Response of RL circuit
• Identify, Calculate and Solve Natural Response of RC circuit
• Identify, Calculate and Solve Step Response of RL circuit
• Identify, Calculate and Solve Step Response of RC circuit

Lab 1 – Introduction to basic laboratory equipment

Lab 2 – Series/Parallel resistor and verification of Kirchoff`s Laws.

Lab 3 – Nodal Analysis

Lab 4 – Mesh Analysis

Lab 5 – Thevenin`s Theorem and Maximum Power Transfer

Lab 6 – Norton`s Theorem and Maximum Power Transfer

1. Charles K. Alexander & Mathew Sadiku, ” Fundamental of Electric Circuit”, 4^th International Edition, McGraw-Hill, 2009

1. Richard C. Dorf & James A. Svoboda, “Introduction to Electric Circuits”, 6^th Edition, John Wiley & Sons, 2004.

2. J. David Irwin & Chwan-Hwa Wu, “Basic Engineering Circuit Analysis”, 6^th Edition, John Wiley & Sons, 2001.

3. Clayton R. Paul, Charles Paul, “Fundamentals of Electric Circuit Analysis”, John Wiley & Sons, 2000.

4. Johnson, D.E. Johnson, J.R. & Hilburn, J.L., “Basic Electric Circuit Analysis”, 5^th Edition, Prentice Hall, 1996

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CO1: Ability to apply engineering drawing  concepts  and principles to solve engineering and science problems.

CO2: Ability to apply drawing techniques and tools to design engineering drawings.

CO3: Ability to demonstrate drafting & technical drawings with correct methods.

CO4: Ability to solve engineering related problem using engineering drawing techniques.

• To define objective & list types of drawing techniques with crucial engineering drawings, drawing tools, drawing standards, title blocks & texts, measurements & scales. Toillustrate types of standard lines, text & numbering, border lines & title box.

• To define methods to draw lines, constructing & dividing lines & angles, drawing simple geometrical shapes, tangent lines & spread outs. To analyze & sketch stretching theory & orthographical stretching concepts, types of orthographical stretching view, first stretching angle, third stretching angle, isometric stretching.
• To compare & sketch dimensional standards at orthographical stretching, connection between drawings dimension & drawing works. To describe & sketch basic concept of additional stretching, relation between orthographical stretch & additional stretch.

• To analyze & sketch stretching theory & orthographical stretching concepts, types of orthographical stretching view, first stretching angle, third stretching angle, isometric stretching. To compare & sketch dimensional standards at orthographical stretching, connection between drawings dimension & drawing works. To describe & sketchbasic concept of additional stretching, relation between orthographical stretch & additional stretch.
• To describe & sketch basic concept of additional stretching, relation between orthographical stretch & additional stretch.

• To analyze & sketch types of drawing, isometric drawing, oblique drawing, standard practice.

• To examine & sketch Standard graphical symbols & block diagrams, schematic drawings, wiring & cable diagrams, Printed Circuit Board. Circuit & schematic drawing.

• To recognize & demonstrate the AutoCAD screen, to respond by typing commands, starting a new drawing, using limits, grid, snap, zoom, line, absolute coordinates, erase, offset, undo, adding text, inserting a block & method to print.

• To analyze & sketch using trim, fillet, chamfer, view port, editing text & explode. To sketch using relative X & Y coordinates, polar coordinates, using layers, using object snap, arc, circle, ellipse, & pan real time.

• To analyze & sketch using polygon, polar tracking, extend, rotate, move, mirror & array. Cutting planes line & boundary hatch.
• To sketch planes line & boundary hatch.

• To identify & illustrate 3D coordinate systems, user coordinates system, showing the solids toolbar, using the view toolbar, view point, creating solid models with extrude & revolve, extruding a shape, using Boolean operations, creating solid models revolution

• To analyze & construct a solid model to a multi view drawing using solview & soldraw.

• To analyze & sketch circuit & schematic drawing.

1. Introduction to Basic Engineering Drawing

2. Geometry drawing

3. Stretch system

4. Oblique & isometric drawings

5. Electrical & Electronics Drawings

6. Introduction to Computer Aided Drafting

7. Basic editing & construction techniques

8. Creating 2D drawing (geometric constructions)

9. Introduction to 3D solid modeling

10. To produce 2D drawing from 3D solid modeling

11. Producing electronic drawing

1. Gary R Bertoline, Eric N Wiebe,  “Technical Graphics Communication”, 3^rd ed., McGraw Hill, 2003
2. Shawna Lockhart, “A Tutorial Guide to AutoCAD 2005”, Prentice Hall, 2005

1. Frederick E. Giesecke, Henry Cecil Spencer, John Thomas Dygdon, Alva Mitchell, Ivan Leroy Hill, James E Novak, “Technical Drawing” 10^th ed., Prentice Hall, 2002
2. Mark Dix & Paul Riley, “Discovering AutoCAD 2005”, Prentice Hall 2006
3. M. Ramzan Mainal, Badri Abdul Ghani, Yahya Samian, “Lukisan Kejuruteraan Asas”, Cetakan Keenam, Universiti Teknologi Malaysia (UTM), 2000.
4. Khairul Anwar Hanafiah, “Lukisan Kejuruteraan Berbantu Komputer”, UTM Skudai, 1999 

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CO1:    Ability to identify, define and solve theory of semiconductor materials and diode operation.

CO2:    Ability to define, illustrate and calculate diode applications.

CO3:    Ability to describe, explain and solve Bipolar Junction Transistor (BJT) operation and biasing. 

CO4:    Ability to describe, explain and solve Field Effect Transistor (FET) operation and biasing.

Define, illustrate and explain the atomic structures, semiconductors, conductors, insulators and covalent bonds. Describe the conduction in semiconductor, n-type and p-type semiconductor. Define diode. Explain diode operation and biasing. Solve voltage and current characteristics of various diode models.

List diode application. Define, differentiate and explain half-wave and full-wave rectifiers. Define and compare diode limiting and clamping circuits. Solve rectifiers, power supply filters, regulations, limiting, clamping circuit and voltage multipliers related problems and illustrate the output waveform. Describe Zener diode operation and solve related problem.

Define BJT. Illustrate types of transistor structure and symbol. Explain basic transistor operation, transistor characteristic and parameters. Explain BJT configuration. Calculate BJT parameters. Illustrate DC load-line.

Explain types of biasing and DC operating points. Solve Fixed bias (Base Bias) and Emitter Bias operation parameters. Calculate voltage divider bias parameters by using exact and approximation analysis. Solve collector feedback and other bias parameters.

Define FET. Illustrate types of FET structure and symbol. Explain JFET operation. Explain JFET characteristic and parameters. Describe, sketch and calculate JFET transfer characteristic. Explain JFET biasing. Solve JFET bias related problem. Define MOSFET. Illustrate type of MOSFET structure and symbol. Explain MOSFET operation. Explain MOSFET biasing. Solve MOSFET bias related problems.

1. Introduction to basic laboratory equipment
2. Introduction to
3. Diode as Rectifiers
4. Limiter and Clamper Circuits
5. Current and Voltage Characteristics of BJT
6. Voltage Divider Biasing
7. JFET Characteristics

1. Floyd, T.L., “Electronic Devices”, 8^th edition, Prentice Hall 2008

1. Boystead, R.L. & Nashelsky, L. “Electronic Devices and Circuit Theory”, 10^th edition, Prentice Hall, 2009

2. Cathey, J.J., “Schaum’s outline of theory and problems of electronic devices and circuits”, 4^th ed, McGraw-Hill, 2002.

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CO1: Ability to IDENTIFY, DEFINE and EXPLAIN the sinusoids, phasor, capacitor and inductor in AC circuits and also use the method of circuit analysis and network theorem to SOLVE the electrical problem.

CO2: Ability to IDENTIFY and CALCULATE all the parameters for series and parallel resonance   circuits.

CO3: Ability to IDENTIFY, CALCULATE and SOLVE the First Order Circuit.

CO4: Ability to IDENTIFY, CALCULATE and SOLVE the electrical circuit using two port networks parameter.

• Explain the different between AC and DC
• Define cycle, period and frequency of sinusoid and solve for RMS value.
• Sketch and explain the graph of sinusoid using analytical expression.
• Use and illustrate phase relationship of waveforms using phasors.
• Identify and explain complex number, phasors and complex numbers in rectangular or polar form and covert between the two.
• Explain lead and lag relationships with phasors and sinusoids.

• Explain the relationship between AC voltage and current in a resistor, capacitor and inductor and also causes a phase shift between current and voltage.
• Define and explain capacitive and inductive reactance and relationship between capacitive reactance and frequency.
• Explain the effects of extremely high and low frequencies on capacitor and inductor.

Describe and apply Kirchhoff’s Laws (Voltage & Current), voltage and current divider and also star/delta transformation

• Describe, Apply and Solve using Mesh analysis in AC Circuits
• Describe, Apply and Solve using Nodal analysis in AC Circuits

• Describe, Apply and Solve using Superposition theorem
• Describe and Apply Source transformation
• Describe, Applyand Solve using Thevenin & Norton theorem
• Evalute and Calculate Maximum power transfer
• Perform and Calculate Power factor correction

• Identify and Calculate the instantaneous power,average power, Power Factor, Complex Power, Power Factor Correction
• Identify and Calculate the instantaneous power,average power, Power Factor, Complex Power, Power Factor Correction.

• Identify, Calculate and Solve Balanced three phase voltages.
• Identify, Calculate and Solve Three phase voltage source and relationship between line and phase voltages and currents,Source and load connections:Wye-Delta,Wye-Wye
• Identify, Calculate and Solve Three phase voltage source and relationship between line and phase voltages and currents,Source and load connections:Delta-Delta,Delta-Wye.Calculate Power calculation in three phase system

• Identify the circuit and Calculate all the parameters for series resonance circuits
• Identify the circuit and Calculate all the parameters for Parallel resonance circuits.

• Describe, Apply, and Solve using Z and Y parameter
• Describe, Apply, and Solve using T (ABCD) parameter and Terminated two port networks

1. Lab 1: Introduction To The Equipment and Measurement
2. Lab 2: Measurement of Phase Shift
3. Lab 3: Capacitor in AC Circuit
4. Lab 4: Inductor in AC Circuit
5. Lab 5: Series Resonance Circuit

1. Charles K. Alexander & Mathew Sadiku, ” Fundamental of Electric Circuit”, 4^th International Edition, McGraw-Hill, 2009

1. Richard C. Dorf & James A. Svoboda, “Introduction to Electric Circuits”, 8^th Edition, John Wiley & Sons, 2010.

2. Nilsson, J.W., Riedel, S.A., ‘’Electric Circuits’’, 8^th Ed., Prentice Hall, 2008.

3. J. David Irwin & Chwan-Hwa Wu, “Basic Engineering Circuit Analysis”, 6^th Edition, John Wiley & Sons, 2001.

4. Clayton R. Paul, Charles Paul, “Fundamentals of Electric Circuit Analysis”, John Wiley & Sons, 2000.

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CO1:   Ability to identify and sketch flowcharts to solve engineering and science problems.

CO2:    Ability to use and apply three types of control statements; sequence, selection and repetition.

CO3:    Ability to build C program using functions, and file operations.

CO4:    Ability to construct dynamic data structures using pointers, arrays and multidimensional arrays.

Definition and description of Algorithm, Pseudo-code and flowchart. Determination of Identifiers and Reserved words, Preprocessor directives, data types and type declarations, Operators, Formatted input and formatted output, Program debugging

Learn about types of selection; One way selection, Two ways selection, Multi selection and Compound Statement, Construct C program using: Nested if, Conditional operators and Switch operators

Learn, use and apply; While loops and Do-while loops, Learn, use and apply; For loops and Nested loops

Learn and construct C program using; Library (Math & String), User-defined, Learn and construct C program using; Scope (global & local) and Passing arguments (by value)

Identify and use file declaration, file operations and file mode, Reading data from text files and writing data to text files

Define and initialize to pointer variables, pointer operators

Define an arrays of data, and declaration of Array, Initialization of array and operations on array, Identify and use multidimensional arrays and index out of bound

1. Introduction to C programming
2. Conditional statements
3. Loops
4. Functions
5. File operations
6. Pointers
7. Arrays
8. Multidimensional arrays

1. Harry H.Cheng,“C for Engineers and Scientists, An Interpretive Approach”, McGraw Hill International Edition, 2010

2. Deitel & Deitel, Suhizaz Sudin, R. Badlishah, Yasmin Yacob “C How To Program”, Pearson-Prentice Hall, 2006

1. Jeri R. Hanly & Elliot B. Koffman “C Program Design for Engineers”,Addison-Wesley, 2001

2. Tan & D Orazio  “C Programming for Engineering & Computer Science” , Mc Graw Hill , 1999

3.  Forouzan, B. A. & Gilberg R. F., “Computer Science: A Structured Programming Approach Using C”, Brooks/Cole, 2001

4. Al Kelley, Ira Pohl, “C by Dissection: The Essentials of C Programming” 4th ed., Addison-Wesley, 2000

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CO1:    Ability to define and describe the concepts and principles of logic design.

CO2:    Ability to define, describe and demonstrate combinational logic design using logic simplifications and circuit transformation.

CO3:    Ability to define, describe and illustrate combinational logic functions.

Define Design; Logic Design. Explain Hierarchical Design; CAD Software; Logic Computation using Switches, Relays and Circuits; Transistors; Digital Representations; Encoding

Describe and Discuss numbers in Binary, Octal, Hexadecimal; Conversion Between Binary, Octal, Hexadecimal; Binary Arithmetic Operations;

Define and Explain the Inverter, AND, OR, NAND, NOR, EX-OR and EX-NOR Gates.

Describe and Apply laws and rules of Boolean algebra, Sum-of-Product (SOP) and Product-of-Sum. Describe and Apply Conanical forms, Karnaugh Map. Explain hazards and glitches

Define and Explain the Combinational Logic Circuits;  Demonstrate Combinational Logic Implementation; The Universal Property of NAND and NOR Gates; Logic Circuit

Explain, Discuss and Illustrate the concept and design of Encoders and Decoders;

Explain, Discuss and Illustrate the concept and design of Multiplexers and Demultiplexers;

Explain, Discuss and Illustrate the concept and design of Comparators, Parity;

Explain, Discuss and Apply Representation of Negative Numbers (Sign-Magnitude;1’s Complement; 2’s Complement); Arithmetic Operations of Signed Numbers; Overflow. Describe, Discuss and Illustrate Half Adder; Full Adder; Describe, Discuss and Illustrate Ripple Carry Adder; Carry Look-ahead Adder

Explain, Discuss and Illustrate the concept and design of Arithmetic Logic Unit (ALU);  Explain, Discuss and Illustrate the concept and design of Simple Combinational Multiplier

Lab 1 : Introduction to Digital Laboratory

Lab 2 : Logic Gates Functions and Characteristics

Lab 3 : Logic Simplification

Lab 4 : Encoder / Decoder

Lab 5 : Multiplexer / Demultiplexer

1. T. L. Floyd, “Digital Fundamentals”, 10^th Edition, Prentice Hall, 2009.

1. R. H. Katz and G. Borriello, “Contemporary Logic Design”, 2^nd Edition, Prentice Hall, 2005.

2. R. J. Tocci, N. S.Widmer and G. L. Moss, “Digital Systems: Principles and Applications”,10th Edition, Prentice Hall, 2006.

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DMT 125/2

CO1:     Ability to describe types of material families, material properties, and strategy for designing material.

CO2:     Ability to analyze, calculate, and compare various material characteristic by measuring material’s mechanical properties on strain, stress, and density, fracture, and friction.

CO3:     Ability to analyze and compare the structure and mechanical behavior of metal, polymer, ceramic and  composite.

CO4:    Ability to analyze and explain specific material properties that related to the field of electric, magnetic, and optical.

CO5:    Ability to describe and explain material life cycle, oxidation and corrosion mechanism of material

Differentiate material families and processes and describe material properties that include Mechanical Properties, Thermal Properties, Electrical, magnetic, and optical properties.

Primary & secondary bonding, electronic structure

BCC, FCC & HCP crystal structure, atomic position in cubic structure

Direction in unit cell, miller indices

Type of crystalline imperfections

Describe elastic mechanisms and analyze strength, plastic work and ductility Analyze strength and toughness and describe the mechanics of fracture.

Recognize the structure and mechanical behavior of alloy and metal, e.g. Kinetics of structural change

Recognize the mechanical behavior of polymer and rubber material.

Recognize the mechanical properties of ceramics, glasses,  and composite materials

Heat capacity, thermal expansion & diffusion mechanism

Recognize and analyze electrical properties of materials

Recognize and analyze magnetic and optical properties of materials.

Describe oxidation mechanism and oxidation resistance. Identify corrosion materials and explain methods to deal with corrosion.

Describe microstructure of materials and evolution in processing.  Recognize material life cycle and criteria for assessment.

1. William F. Smith, Javad Hashemi, “Foundations of Material Science & Engineering”, 5^th ed, McGraw Hill, 2010

1. Ashby, M. and Jones, D.R.H. (2005). Engineering Materials I: An Introduction to Properties, Applications, and Design, 3rd Edition, Elsevier, Butterworth Heinemann.
2. Ashby, M. and Jones, D.R.H. (2006). Engineering Materials II: An Introduction to Microstructure, processing, and design, 3rd Edition, Elsevier, Butterworth Heinemann.
3. Sharma, C.P. (2004). Engineering material properties and applications of metal and alloys, Prentice Hall, New Delhi.
4. Rajput, R.K. (2000). Engineering Materials. S.Chand & Company, New Delhi. 

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CO1:    Ability to state types of biasing, describe the function of components and determine important DC and AC parameters of amplifiers using Bipolar Junction Transistors (BJTs).

CO2:    Ability to state types of biasing, describe the function of components and determine important DC and AC parameters of amplifiers Field Effect Transistors (FETs) amplifiers.

CO3:    Ability to state types and classes, describe the function of components and determine important DC and AC parameters of multistage and power amplifiers.

Review of FET (MOSFET & JFET) and BJT. Identify and Solve DC Biasing. Sketch DC & AC load line

BJT Amplifiers – Common Emitter

–                     Explain Analog Signals & Linear Amplifiers

–                     Identify Transistor Amplifier Configurations

–                     Perform/Solve DC  & AC Analysis of Common-Emitter Amplifier

–                     Perform/Sketch AC Load Line Analysis

BJT Amplifiers – Common Base

–                     Identify Transistor Amplifier Configurations

–                     Perform/Solve DC  & AC Analysis of Common-Base Amplifier

–                     Perform/Sketch AC Load Line Analysis

BJT Amplifiers – Common Collector

–                     Identify Transistor Amplifier Configurations

–                     Perform/Solve DC  & AC Analysis of Common-Collector Amplifier

–                     Perform/Sketch AC Load Line Analysis

FET Amplifiers – Common Source

–                     Identify Transistor Amplifier Configurations

–                     Perform/Solve DC  & AC Analysis of Common-Source Amplifier

–                     Perform/Sketch AC Load Line Analysis

FET Amplifiers – Common Gate

–                     Identify Transistor Amplifier Configurations

–                     Perform/Solve DC  & AC Analysis of Common-Gate Amplifier

–                     Perform/Sketch AC Load Line Analysis

FET Amplifiers – Common Drain

–                     Identify Transistor Amplifier Configurations

–                     Perform/Solve DC  & AC Analysis of Common-Gate Amplifier

–                     Perform/Sketch AC Load Line Analysis

Cascade Configuration Multistage Amplifier

–                     Identify Transistor Amplifier Configurations

–                     Perform/Solve DC  & AC Analysis of Cascade Multistage Amplifier

Darlington Configuration Multistage Amplifier

–                     Identify Transistor Amplifier Configurations

–                     Perform/Solve DC  & AC Analysis of Darlington Multistage Amplifier

Class A Power Amplifier

–                     Identify Class of Power Amplifier

–                     Perform/Solve Class A Power Amplifier analysis

Class B Power Amplifier

–                     Identify Class of Power Amplifier

–                     Perform/Solve Class B Power Amplifier analysis

Class AB Power Amplifier

–                     Identify Class of Power Amplifier

–                     Perform/Solve Class AB Power Amplifier analysis

Class C Power Amplifier

–                     Identify Class of Power Amplifier

–                     Perform/Solve Class C Power Amplifier analysis

1. Lab 1: BJT Common Emitter Amplifier (Q point, DC current voltage load line & voltage line)

2. Lab 2: BJT Common Emitter Amplifier II (AC Load line, Amplifier Voltage Gain)

3. Lab 3: BJT Common Collector Amplifier (Voltage gain input & output impedance)

4. Lab 4: FET Common Source Amplifier

5. Lab 5: Class A Power Amplifier

1. Neamen, D.A. (2007) Microelectronics Circuit Analysis and Design. Third Edition , McGraw Hill.

 References:

1. Floyd, T. (2005). Electronic Devices. 7^th Edition Englewood Cliffs, New Jersey : Prentice Hall.

2. Boylestad, R.L, and Nashelsky, L. (2006). Electronic Devices and Circuit Theory. 9^th Ed.: Prentice-Hall

3. Robert T. Paynter, (2005). Introductory Electronic Devices and Circuits. 9^th Ed.: Prentice Hall.

4. Clemons Evangelisti, Kerr. and Klingensmith. (1994). Introductory Electronic Devices and Circuits. 3^rd ed New Jersey Englewood : Prentice Hall

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CO1:    Ability to solve  the basic concept of three phase system.

CO2:    Ability to apply the basic concept of magnetic circuit and machinery principles.

CO3:    Ability to define and explain the basic principles of transformer (including its general construction) and solve the fundamental equations describing its behavior.

CO4:    Ability to apply parameters for electrical machines.

Define and explain characteristics of three-phase system. Explain Star-Delta connections, Delta-Star connections. Solve three-phase power

Describe, explain and apply magnetic field, magnetic relationship, magnetic core losses. Describe, explain and apply magnetic circuit, inductance. Describe, explain and apply magnetic force, electromagnetic induction, induced emf.

Describe, explain and apply Rotational Motion, The Magnetic Field, Faraday’s Law – Induced Voltage from a time-changing Magnetic Field, Production of Induced Force on a Wire and Induced Voltage on a conductor moving in a magnetic field

Describe and explain basic construction. Describe and explain principle operation and the importance of transformer. Apply ideal transformer. Identify and apply equivalent circuit of a transformer. Define and solve voltage regulation and efficiency of a transformer

Describe, explain, and apply basic construction, principles and application of: DC Machines, induction machines, and AC Machines. Describe, explain, and apply basic construction, principles and application of: induction machines. Describe, explain, and apply basic construction, principles and application of: AC Machines.

Experiment 1: Introduction to LVVL software.

Experiment 2: Three-phase power measurement.

Experiment 3: Single-phase transformer – transformer regulation.

Experiment 4: Separately-excited, shunt and compound dc generators.

Experiment 5: Principle of a three phase induction motor.

1. Stephen J. Chapman. Electric Machinery Fundamentals, 4^th Edition, McGraw Hill, 2005

1. Charles K.Alexander & Matthew Sadiku, “Fundamentals of Electric Circuits”, International Education, McGraw Hill, 2001

2. P.C. Sen. Principles of Electric Machines & Power Electronics, 2nd Edition, John Wiley & Sons, 1997

3. Edward Hughes, Ian Mckenzie Smith, John Hiley, Keith Brown. Hughes Electrical & Electronic Technology, Prentice Hall, 2003

4. Stephen L. Herman. Electrical Transformers and Rotating Machines, 2nd Edition, Thomson Delmar Learning, 2006.

5. Nilsson, J.W. & Riedel, S.A., “ Electric Circuits”, 7th Edition, Pearson Prentice Hall, 2005.

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CO1:    Ability to describe, explain and discuss the operation of flip flop, its applications and use the flip flops in synchronization circuits.

CO2:    Ability to explain, constructs, discuss and classify the counter circuit and shift register and understand the operation of various types of registers.

CO3:    Ability to explain and analyze the basic sequential circuit.

Describe and explain Latches, Gated Latches and Edge triggered flip flops. Explain the Applications of flip flops

Define and explain Asynchronous and  Synchronous Counter Operation. Explain and discuss the Synchronous Counter Design

Define, discuss, and apply the Up / Down Synchronous Counters. Demonstrate the Design Counter Applications

Describe Basic Shift Register Functions. Explain and illustrate the operation of registers. Identify types of Shift Register. Discuss and illustrate the Basic Shift Register Operations

Describe and explain the bidirectional shift register operation. Discuss and illustrate the Shift Register Counters . Discuss and illustrate the Shift Register Applications : State Registers, Serial Interconnection of Systems, Bit Serial Operations, UART

Define, describe and use the Sequential Circuit, Input Equation and The State Stable. Identify and explain the Type of Sequential Circuit

Discuss, explain, use and analyze the State Diagram. Explain, apply and analyze the sequential circuit  with flip-flops

Exp 1: Latches & Gated Latches

Exp 2: Flip Flop

Exp 3: Counter Design

Exp 4: Shift Register Applications

Exp 5: State Machine

1. Ronald J.Tocci, Neal S.Widmer and Gregory L.Moss, “Digital Systems: Prinsiples and Applications”, 10^th Edition by Prentice Hall 2006

1. Floyd, Thomas L., “Digital Fundamentals”, 9^th Edition by Prentice Hall 2006

2.  Rafikha Aliana A. Raof et al, “Digital Electronic Design”, by Pearson, Prentice Hall

3. Donald D. Givone, “Digital Principles and Design”, by McGraw-Hill 2003

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CO1:     Ability to explain the theory of semiconductor physics and devices.

CO2:     Ability to apply and solve problem and performance issues in semiconductor processes.

CO3:     Ability to apply knowledge in item 1 and 2, and to explain semiconductor devices behaviours.

Introduction to semiconductor devices and technology

Semiconductor materials, basic crystal structure and growthtechniques, valence bonds and energy bands, intrinsiccarrier concentration, donors and acceptors.

Carrier drift and carrier diffusion, generation and recombination process, and continuity equation      Thermionic emission process tunneling process, and high-field effects.                                                                            

Basic fabrication steps, thermal equilibrium condition, depletion region and capacitance, and C-V characteristics. Charge storage and transient behavior, junction breakdown, and heterojunction.

The transient action, static characteristics of bipolar transistor, frequency response and switching of bipolar transistor, and the heterojunction bipolar transistor.

The MOS diode, MOSFET fundamentals, and MOSFET scaling, CMOS and BiCMOS

CMOS, BiCMOS and MOSFET on insulator

MOS memory structures and The power MOSFET

Metal-Semiconductor Contacts, MESFET and MODFET

Semiconductor laser, photodetector, and solar cell.

1. S. M. Sze, Semiconductor Devices: Physics and Technology, 2^nd Ed., John Willey & Sons, Inc., 2005.

1. S. M. Sze, K. K. Ng, Physics of semiconductor devices, John Wiley, 2007, USA.

2. F. P. Robert, Advanced Semiconductor Fundamentals, 2^nd ed. 2003, Prentice Hall, USA.

3. Peter Y. Yu, M. Cardona, Fundamental of Semiconductors: Physics and materials properties  (advanced text  in physics), Springer-Verlag, 2001, Germany.

4. G. G. Streetman, S. K. Banerjee, Solid State Electronic Devices, Prentice Hall, 2006, USA.

5. K. Kramer, W. Nicholas, G. Hitchon, Semiconductor Devices: A Simulation Approach, Prentice Hall, 1997, USA.

6. D. A. Neamen, Semiconductor physics and devices, Mcgraw hill, 3^rd ed. 2003, USA.

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CO1:    Ability to explain and apply the microelectronic technologies, IC design flow and VLSI design style in Layout

CO2:    Ability to describe, explain and sketch the CMOS transistor concept, characteristic and logic circuit design

CO3:    Ability to illustrate and produce layout design flow of a circuit

Describe and explain the Microelectronics technologies, Integrated Circuit, Moore’s Law, Integration Scales, EDA applications in the design of ics, IC design flow, Simulation and Fabrication of IC.

Describe, discuss and apply  the flow of SPICE netlis, significance of SPICE, Netlist SPICE elements, types of SPICE analysis and input stimulus. Describe, discuss and apply  the flow of SPICE netlist, significance of SPICE, Netlist SPICE elements, types of SPICE analysis and input  stimulus.

Relate and illustrate the masks and layout drawing as circuit representations. Explain and apply sticks diagram in Layout design. Define and apply the well, body contacts, contacts and vias in mask layout.. Explain and illustrate the multilayer interconnections. Relate and illustrate the masks and layout drawing as circuit representations. Explain and apply sticks diagram in Layout design. Define and apply the well, body contacts, contacts and vias in mask layout..Explain and illustrate the multilayer interconnections.

Identify and apply the Design Rules Check (DRC), Layout Versus Schematic (LVS) and  SDL during Layout verification. Identify and apply the Design Rules Check (DRC), Layout Versus Schematic (LVS) and SDL during Layout verification.

Remember, discuss and illustrate the concepts, characterization and operation of Bipolar Junction Transistor (BJT), JFET, nMOS, pMOS and types of CMOS. Remember, discuss and illustrate the concepts, characterization and operation of Bipolar Junction Transistor (BJT), JFET, nMOS, pMOS and types of CMOS.

Describe, discuss and illustrate the principles and concepts for transistor representation for pMOS and nMOS as switches. Describe, discuss and illustrate the ideal of IV Characteristic. Apply the design of Inverter, NAND, NOR and complex logic gates in layout. Explain and sketch the combinational and sequence logic gate.  Describe, discuss and illustrate the principles and concepts for transistor representation for pMOS and nMOS as switches. Describe, discuss and illustrate the ideal of IV Characteristic. Apply the design of Inverter, NAND, NOR and complex logic gates in layout. Explain and sketch the combinational and sequence logic gate. Describe, discuss and illustrate the principles and concepts for transistor representation for pMOS and nMOS as switches. Describe, discuss and illustrate the ideal of IV Characteristic. APPLY the design of Inverter, NAND, NOR and complex logic gates in layout. Explain and sketch the combinational and sequence logic gate.

Identify and discuss the principles of Field Programmable Gate Array (FPGA), Gate Arrays, Standard cells, Full custom design, System-on-Chip (SoC), Building blocks, chip layout, input and output circuits. Identify and discuss the principles of Field Programmable Gate Array (FPGA), Gate Arrays, Standard cells, Full custom design, System-on-Chip (SoC), Building blocks, chip layout, input and output circuits

1. Lab 0: Introduction To Mentor IC Design Suite

2. Lab 1: Netlists using Eldo simulator

3. Lab 2: Schematic Design

4. Lab 3: Layout Design

5. Lab 4: Design Rules Check (DRC)

6. Lab 5: Layout versus Schematic (LVS)

1. Neil H.E. Weste, David Harris. (2005). CMOS VLSI Design. Addison Wesly.

1. John P.Uyemura (1995). Physical Design of CMOS Integrated Circuits using L-Edit^TM”, PWS Thomson.

2. Christopher Saint, Judy Saint. (2002). IC Layout Basics.  Mc Graw Hill.

3. Christopher Saint, Judy Saint. (2002). IC Mask Design Essential Techniques. Mc Graw Hill

4. Dan Clein. (2000). CMOS IC Layout. Newnes

5. Sung –Mo Kang, Yusuf Leblebici. (2005). CMOS Digital Integrated Circuits –  Analysis and Design. Mc Graw.

6. John P. Uyemura. (1999). CMOS Logic Circuit Design. Kluwer.

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CO1:    Ability to solve the basics of  semiconductor device and ability to explain the cleanroom and cleanroom protocols.

CO2:    Ability to apply the semiconductor process technology and construct the  fabrication processes for thermal and photolithography processes.

CO3:    Ability to apply and construct the fabrication processes in etching and metallization.

Ability to define and describe on semiconductor process technology and wafer fabrication processes

Ability to define Cleanroom standard and compare Cleanroom classes. Ability to define and remember the cleanroom protocols, Cleanroom protocols, Yield

Ability to define, remember, explain and discuss on introduction to semiconductor, Resistivity, Intrinsic and extrinsic semiconductor, Doping of semiconductor, n-type and p-type dopant, Basic Semiconductor Devices

Ability to describe, explain and discuss on oxidation (wet and dry oxidation), Diffusion and Drive-in, Annealing, Rapid thermal process (RTP).

Ability to define, repeat, explain, illustrate and discuss of photolithography, Photolithography basic process, Lithography Technology Trends, Mask, Reticles, Photoresist, -ve photoresist vs +ve photoresist, photoresist handling procedures

Ability to describe, explain on conducting Thin Films, Metal Thin-Film Characteristics, Thermal Evaporation, Sputtering, CVD vs. PVD, and calculate Metal thin film measurement

Ability to define of etching process and its application, Etch terminology; etch rate, selectivity, etch uniformity, illustrate etch profiles, Wet etch; basic process, applications, advantages and disadvantages. Dry etch; plasma basic, ion bombardment, reactive ion etching (RIE)

Ability to define and explain of Plasma, Collision in Plasma; Ionization, Excitation and relaxation, Dissociation, Plasma, Ion Bombardment, PECVD and Plasma Etch Chambers.

1. Introduction to Cleanroom/ Cleanroom protocol

2. Wet and/or Dry Oxidation

3. Metallization

4. Photolithography

5. Wet etching

1. Hong Xiao. (2005). Introduction to Semiconductor Manufacturing Technology. Prentice Hall.

1. Peter Van Zant (2000). Microchip Fabrication: A Practical Guide to Semiconductor Processing. Mc Graw Hill.

2. Campbell, S. A. (2001). Science And Engineering of Microelectronics Fabrication. New York : Oxford University Press

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CO1:    Ability to define and explain the semiconductor packaging process flow.

CO2:    Ability to explain and identify the critical parameters in semiconductor packaging process.

CO3:    Ability to illustrate and relate the technology trend in semiconductor packaging.

Introduction to Microsystems Packaging

To define about Microsystems and Microsystems Technologies, To explain Microsystems Packaging (MSP), Discuss important about microsystem packaging and describe the System Level Microsystems Technologies.

To define about Microelectronic, Microelectronic Devices and IC Packaging, To explain the purposes of IC Packaging Semiconductor Roadmap and IC Packaging Challenges

To explain about Wafer Back Grinding, Die Preparation, Die Attach, Wire Bonding, Die Overcoat, Molding, Sealing, Marking, DTFS (Deflash/Trim/Form/Singulation), Lead Finish, Electrical Testing, Tape & Reel, Dry Packing, Boxing and Labeling.

To define and express the level of Interconnection, Wire Bond, Tape Automated Bonding and Flip Chip.

To define about Design for Reliability, Microsystem Failure & Failure Mechanisms. To explain and classify the Fundamental of Design for Reliability. To explain the Thermomechanically-Induced Failure, Electrical Induced Failure and Chemically Induced Failure

To define about Statistical Process Control (SPC), Poka Yoke, 8D Process, 5S Process, Ishikawa Diagram, Gauge Repeatebility and Reproducibility (GR&R)

Lab 1: Decapsulation

Lab 2: Die Preparation

Lab 3: Wire bonding

Lab 4: Wirebond Pull Test

1. Rao Tummala. (2001).Fundamentals of Microsystem Packaging. Mc-Graw Hill Professional.

1. William D. Brown (Editor). (1999). Advanced Electronic Packaging with Emphasis on Multichip Modules. New York :IEEE Press Series on Microelectronics Systems. The Institute of Electrical and Electronics Engineers Inc.

2. Glenn R. Blackweel. (2000). The Electronic Packaging Handbook. Florida U.S : CRC Press LLC.

3. M. Datta, T.Osaka, J.W Schultze (Editor). (2005). Microelectronic Packaging. Florida U.S : CRC Press.

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CO1:    Ability to define (failure analysis terms), illustrate and select the appropriate failure analysis process flow.

CO2:    Ability to identify, compare, explain, illustrate (where applicable) and analyze the different  techniques available in FA, and the corresponding failures they detect

CO3:    Ability to conduct experiments, investigate and analyze a sample given based on theoretical aspects learned.

define Failure Analysis (FA) , FA techniques, failure modes, failure mechanisms, root cause. Select and illustrate the appropriate failure analysis process flow. Explain differences between destructive and non-destructive techniques.  

Name and explain different types of electrical failures . Analyze the results obtained from electrical characterization analysis.

Identify and explain different techniques use to perform package analysis. Illustrate and explain the concepts and principles of scanning acoustic microscopes. Compare the advantage sand disadvantages of acoustic micro imaging and x-ray/radiographic inspection.

Explain the importance of fault localization. Identify the common fault localization techniques. Illustrate and explain the concepts and principles of thermal based method. Describe photon-based method      select the most suitable fa techniques to be used given a particular failure.

Give the differences between decapsulation and delidding. Illustrate and explain the different types of decapsulation method available Explain the process of backside preparation.

Define deprocessing. Explain the purpose of deprocessing. Explain different types of deprocessing techniques. Differentiate each types of deprocessing techniques. Compare the advantages and disadvantages of each deprocessing techniques.

Explain the concepts and principles of metallographic cross-sectioning techniques. Identify types of failures that can be detected using these FA techniques.

Illustrate and differentiate the concepts and principles of Scanning Electron Microscopy (SEM) and Scanning Probe Microscopy (SPM). Compare the advantages and disadvantages of AFM vs.SEM. Explain other inspection techniques.

Explain the ten primary challenges of FA. Explain the trend of FA                                                                                                                                                                                                                                                                         

Lab 1: Electrical Characterization Using Curve Tracer

Lab 2: Plastic Mold Decapsulation

Lab 3: Reactive Ion Etching

Lab 4: Cross-Sectioning Techniques

  Lab 5: Case study/Mini Project

1.  Perry L. Martin (1999). Electronic Failure Analysis Handbook.: McGraw Hill

2. E. Ajith Amerasekera and Farid N. Najm (1997). Failure Mechanisms  in Semiconductor Devices. 2^nd Ed.: John Wiley & Sons

3. Lawrence C. Wagner, (1999). Failure Analysis of Integrated Circuits: Tools and Techniques.: Kluwer Academic Publishers.

4. Friedrich Beck (1998). Integrated Circuit Failure Analysis: A Guide to Preparation Techniques. : John Wiley & Sons

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CO1:   Ability to describe the basic hardware architecture of a microcontroller system and  sketch the fundamental diagram describing its behavior.

CO2:   Ability to apply knowledge and concepts of microcontroller programming.

CO3:   Ability to use the skill to program a microcontroller system using assembly language.

CO4:   Ability to make connection between microcontroller systems to external devices.

Define basic concepts of  8051 microcontroller architecture. Discuss a digital computer, memory system, input/output devices, microprocessor interface, busses, typical control signals.

Define assembly language programming. Discuss about assembling and running an 8051 program, program counter, ROM. Define data types, flag bits, the PSW register, register banks and stack. Define Jump, Loop and CALL instruction. Discuss time delay for various 8051 chips.

Define timer and interrupt. Discuss Interrupt Info, Interrupt Priority and Enable.

Define 8051 I/O programming and I/O bit manipulation programming.

Define immediate and register addressing modes. Discuss accessing memory using various adressing modes.

Define arithmeric instructions. Discuss signed number concepts and arithmetic operations. Define logic and compare instructions, rotate instruction, data serialization, BCD, ASCII.

Apply display interfacing: LED, Seven segment display. Apply display interfacing: Traffic light control. Define analog interfacing: sampling, A/D and D/A converters, Direct motor speed control. Define serial interfacing: RS232 I/O.

Lab 1 – Introduction to assembly programming and Cross Assembler

Lab 2 –Assembly programming 2 (Arithmetic)

Lab 3 –Assembly programming 3 (Logic)

Lab 4 – Simple Input & Output Controls (Switch and LED)

Lab 5 – Interfacing with Seven Segments Display and ADC control

1. Muhammad Ali Mazidi, Janice Gillispie Mazidi, Rolin D. Mckinlay, “The 8051 Microcontroller and Embedded Systems Using Assembly and C”, Pearson Edition, 2006

1. I. Scott Mackenzie and Raphael Chung-Wei Phan, “ 8051 Microcontroller”, 4^th Edition,  Prentice Hall, 2006.

2. Kenneth J. Ayala, “ The 8051  Microcontroller – Architecture, Programming & Applications ”, 2^nd Edition, WEST, 1997.

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CO1         Ability to identify problem/project , managing and implementing the project, writing the report  and presentation.

CO2         Ability to demonstrate skills acquired in practical work.

CO3         Ability to think logically, decide the right and effective approach in finding solution .

CO4         Ability to work independently and/or in team

CO5         Ability to apply theory into practical

The semestral projects are small scale research projects for final year students and expected to be completed within the same semester. The projects are based of solving the engineering problem by understand the problems, troubleshooting, identify, solves and finally report writing for the documentation purposes. The projects covered on Semiconductor Processing and IC Packaging, Microelectronic Materials, Failure Analysis and Electronic based project.

Any published material such as writing, multimedia or personal communication that related to the project topics. 

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CO1:    Ability to describe, explain and apply the electronic measurement tools such as voltmeters, analog DC and AC meters.

CO2:    Ability to define, explain and construct the DC and AC bridge circuits to measure resistance, capacitance and inductance.

CO3:    Ability to identify, explain the function and solve the circuit of electronic measurement tools such as oscilloscopes and function generators.

CO4:    Ability to recognize and apply knowledge using power processing, transducers, sensors, filter and amplifier in circuit analysis.

Describe the function, characteristic and elements of electronic instruments, Define error and describe type of error in measurement and apply the knowledge of statistical analysis error in electronic measurement.

Sketch and Explain the principles operation of d’Arsonval Meter Movement, Relate the Ayrton Shunt and the using of d’Arsonval Meter Movement in DC Ammeter and DC Voltmeter, Solve the circuit for Ayrton Shunt and d’Arsonval Meter Movement used in DC Ammeter and DC Voltmeter. Describe and solve the Voltmeter Loading Effects and Ammeter Insertion Effects, Explain the operation of Ohmmeter and Multi-Range Ohmmeter.

Describe and solve the circuit for d’Arsonval Meter Movement Used with Half-Wave Rectification and d’Arsonval Meter Movement Used with Full-Wave Rectification. Describe the concept of Electrodynamometer Movement, Iron-Vane Meter Movement, Thermocouple Meter and Loading Effects of AC Voltmeters, Explain the operation of Peak-to-Peak-Reading AC Voltmeters.

Identify, sketch and label the circuit for Wheatstone Bridge and Kelvin Bridge, Illustrate Digital Readout Bridges, Microprocessor-Controlled Bridges, and Bridges Controlled Circuit, Solve the circuit for Wheatstone Bridge and Kelvin Bridge.

Identify, sketch and label the circuit for Similar-Angle Bridge, Maxwell Bridge and Opposite-Angle Bridge, Solve the circuit for Similar-Angle Bridge, Maxwell Bridge and Opposite-Angle Bridge. Identify, sketch and label the circuit for Wien Bridge, Radio-Frequency Bridge, Schering Bridge, Solve the circuit for Wien Bridge, Radio-Frequency Bridge, Schering Bridge.

Sketch and label basic construction of Oscilloscope. Illustrate and explain the Beam Deflection of an oscilloscope. Describe Vertical Amplifier, Horizontal Amplifier, and Sweep Generators, Explain the operation of Storage Oscilloscope, Sampling Oscilloscope and Digital Storage Oscilloscope.

Identify the Requirement for Oscillation. Identify type of Audio Oscillators and Radio-Frequency Oscillators. Solve the circuit for Audio Oscillators and Radio-Frequency Oscillators, Explain the operation of Function Generators and Pulse Generators.

Define and explain Power Electronic and the Basics of Power Processing; AC-DC converter, DC-AC converter ,DC-DC converter, AC-AC converter and Power Rectifier . Identify, solve and illustrate the circuit for AC-DC converter: Phase Angle Control; single phase half-wave and full-wave (R load, R-L load)

Define transducers and sensors, Describe function for each transducer and sensors, Identify and illustrate Passive and Active transducers. Identify type of sensors, amplifier and filter, Describe function of amplifier and filter, Identify, solve and illustrate for each type amplifier and filter.

Lab 1: Error in Measurement

Lab 2: Analog DC Voltmeters

Lab 3: The Wheatstone Bridge

Lab 4:d’Arsonval Galvanometer

Lab 5: Oscilloscope and Signal Generator

Lab 6: Sensors

1. Robert B. Gillies, Quinsigamond Community College, “Instrumentation and Measurement for Electronics Technicians”, 2^nd Edition, Prentice Hall, 1993.

1. Stanley Wolf, California State University, Long Beach, Richard F.M. Smith, California State Polytechnic University, “Student Reference Manual for Electronic Instrumentation Laboratories”, 2^nd Edition, Prentice Hall, 2003.

2. H.S . Kalsi “Electronic Instrumentation”, 2^nd edition, McGraw-Hill, 2004

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CO1:    Ability to define, summarize,   describe the theory and basic concept of PLC and PLC hardware components

CO2:    Ability to produce, develop, create a PLC system using ladder diagram and mnemonic code.

CO3:    Ability to use, apply, change a timer and counter programming, editing and program observation

Describe the PLC history and fundamental aspect of PLC systems. List and describe advantages of a PLC control system, Differentiate PLC vs PC. Explain PLC hardware, programming devices and PLC operation.

Describe the introduction to input output devices. Explain the basic principle of electric switching, Describe the type of switches such as toggle button, push button, selection switch, solenoid switch, Describe and explain the relay electromagnetic and solid state relay, Describe and explain the timer, contactor, sensor and actuator.

Define and describe the overview of number system, decimal system, binary system, bits, bytes, and words. Explain the binary-coded decimal, Describe the hexadecimal number system. Explain the conversion of numbers (binary to decimal, binary to hex and hex to decimal) and gate Boolean equations.

Describe the introduction to PLC programming language. Identify and explain ladder diagram symbols, Explain the basic programming instruction and mnemonic code, Define and explain systematic approach of control system design using a PLC, Identify, solve and illustrate the programming restrictions and self latching circuit.

Define basic operation of timers and counter. List and describe timer’s types and counter, Explain and show the timer and counter programming and industrial applications.

1. Introduction to PLC
2. Ladder diagram & Mnemonic code
3. Advanced Ladder diagram & Mnemonic code
4. Programming a PLC Timer
5. Programming a PLC Counter
6. PLC programming using software programming

1. Frank D. Petruzella, “Programmable Logic Controllers”, 3^rd ed., McGraw–Hill International., 2005

1. W. Bolton, “Programmable Logic Controllers”, 5^th ed., Elsevier Ltd., 2009

2. Jon Stenerson, “Fundamental of Programmable Logic Controllers, Sensors, and Communication”, PEARSON-Prentice Hall, 2005.

3. Gary Dunning “Introduction to Programmable Logic Controller” 3^rd ed., THOMSON DELMAR LEARNING, 2006

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CO1:    Ability to define, explain and illustrate basic structure of control system.

CO2:    Ability to describe, transforms, solve and analyze control system problem into mathematical model.

CO3:    Ability to interpret, solve and analyze system performance.

CO4:    Ability to identify, solve and analyze system stability.

Define basic concepts of control systems. Discuss control system examples in various applications. Explain control system design process. Identify classification of control system; open-loop and close-loop.

Define transfer function. Apply Laplace transform and Inverse Laplace transform to derive transfer function from differential equation. Solve mathematical modeling by analyze electrical and mechanical system.

Define block diagram and signal flow graph. Transform block diagram to signal flow graph. Analyze block diagram and signal flow graph simplification to produce transfer function.Discuss Mason’s rule reduction method.

Discuss transient response and steady state response of a first and a second order system. Interpret zero and poles location towards system response. Analyze system performance.

Define test input signal and system type. Derive steady state error from open-loop and close-loop transfer function. Analyze steady state error for unity and nonunity feedback system. Calculate static error constant.

Describe stability, instability and marginal stability. Explain Routh-Hurwitz criterion. Analyze system stability using Routh-Hurwitz criterion technique.

Describe root locus concept and characteristics. Explain root locus procedure. Illustrate root locus and root contour. Analyze system stability by root locus technique.

Define frequency response. Solve analytical expression for frequency response. Discuss Bode Plot asyptotic approximation sketch method. Sketch Bode Plot and calculate phase and gain margin. Determine system stability using Bode Plot.

Describe basic introduction to PID Controller. State function of PID.

LAB 1 : Introduction To Matlab Simulink

LAB 2 : Open-Loop & Close-Loop Systems Characteristics

LAB 3 : Electrical & Mechanical Modeling

LAB 4 : Time Response Analysis

LAB 5 : Stability

1. Norman S. Nise: Control System Engineering-5^th ed, John Wiley & Sons, 2008.

1. Richard C. Dorf & Robert H. Bishop:  Modern Control Systems-9^th ed, Prentice Hall, 2001

2. Ogata, Katsuhito: Modern Control Engineering-4^th ed, Prentice Hall, 2002.